Nvidia is hiring a
Senior Electro-Optical Packaging Lab Practical Engineer
NVIDIA has continuously reinvented itself over three decades. Our invention of the GPU in 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are difficult to address, that only we can seek, and that makes a difference to the world. Join us in revolutionizing the world of AI!
We are now looking for an Engineering Lab Technician in the Optical Assembly team to support developing new NVIDIA's products. This newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help build and develop our industry leading transceivers. In this role you will run multiple sophisticated assembly platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. The primary responsibility is to support our engineering teams during development to ensure outstanding quality GPU server products may be released to the market and delight our customers so that AI scientists and datacenter operators can achieve their professional aspirations using NVIDIA technology. The new lab team member will work independently to complete daily tasks according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.
What you’ll be doing:
Participating in development of new packaging technologies while working tightly with process development team.
Prepare and conduct experiments to test new assembly technologies and materials.
Operation and maintenance of variety of platforms involved in process of packaging - Wire Bonding/Pick&Place/Active Alignment.
Maintain laboratory hardware and handle materials.
What we need to see:
Electrical/Mechanical Practical Engineer diploma.
4+ years experience in manufacturing environment - microelectronics or packaging.
Operator level on machines involved in packaging process -Pick&Place/flip Chips/BGA/Wire Bonding.
Good attention to detail, as well as clear written and verbal communications.
Ways to stand out from the crowd:
Previous experience in Optical packaging production line.
Demonstrated hands-on experience in two of three leading packaging platforms - Wire Bonding/Pick&Place/Active Alignment.
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