Nvidia is hiring a
Senior Package Development Engineer
We are now looking for a Senior Package Development Engineer in the Advanced Technology Group (ATG).
NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a passionate Packaging Engineer who is committed to making a difference in the world through their contributions. You will be responsible for leading package development of 2.5D and Flip Chip BGA packages for Nvidia's datacenter products.
What you’ll be doing:
The engineer will be responsible for defining package design rules, process flow and material set
Lead package development to establish package manufacturability and reliability
Drive package and substrate qualification activities from initial concept to production
Work closely with offshore fab, assembly and substrate partners
Collaborate with multi-functional teams with in Nvidia and define package requirements
What we need to see:
MS in Materials Science, Mechanical Engineering, Physics or related fields or equivalent experience
6+ years packaging experience
Expertise in 2.5D/CoWoS/Package Assembly/Wafer level technologies
Strong problem solving skills
NVIDIA has some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.The base salary range is $132,000 - $212,750. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.
You will also be eligible for equity and benefits.
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